September 7, 2017
Toshiba Electronic Devices & Storage Corporation today announced the launch of “TB67B000FG,” a new three-phase brushless fan motor driver for air conditioners, air purifiers and other home appliances, and for industrial equipment. The new driver is a package addition to the “TB67B000 series,” which realizes highly efficient fan-motor drive and noise reduction in a single package.
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TB67B000FG is a sine-wave motor driver IC in the HSSOP34 surface-mount package. Sample shipments start today.
Growth in the fan motor market has increased demand for packages that support reflow mounting to secure more efficient board manufacturing. TB67B000FG’s adoption of the small HSSOP34 surface mount package realizes this objective. Components can be mounted on boards automatically, improving fan-motor manufacturing efficiency. On top of this, the required mounting area is about 53% smaller than that for the ‘TB67B000HG’ sine-wave driver IC, which is packaged in ‘HDIP30,’ a conventional lead-insertion package. The new IC contributes to board space-saving.
Small surface mount package for reflow mounting
1.The small 36-pin HSSOP package (mounting area: 17.5 × 11.93mm) is adopted. A heat radiation pad on the package surface improves heat dissipation. Components can be mounted on boards automatically, as the package enables reflow mounting. The required mounting area is 53% smaller than that of its predecessor, which is housed in an HDIP type package (mounting area: 32.8 × 13.5mm)
2.Sine-wave drive with a rating of 500V/2A is realized in a single package.
The sine-wave motor control IC and IGBT (rating of 500V/2A) are integrated in a single package. This reduces the size of mounting area and board layout, and contributes to overall system cost reduction.
3.Malfunction due to noise is prevented.
Malfunction due to noise is prevented by a latch circuit in the hall sensor input. Built-in digital and analog filters realize more stable motor operation.
4.Built-in error detection functions
Error detection functions for motor lock detection, under voltage lock out for power control, and thermal shutdown are incorporated