October 30, 2018
Toshiba Electronic Devices & Storage Corporation (“Toshiba”)has added “TC35681IFTG”, a new IC for automotive applications, to its line-up of ICs compliant with Bluetooth® low energy (LE) core specification v5.0. The new device is suited to use in demanding automotive environments, as it delivers a wide operating temperature range, high RF transmission power and high RF reception sensitivity (a link budget of 113dB @125kbps at long range transmission). The mixed-signal TC35681IFTG contains both analog RF and baseband digital parts to provide a complete solution on a single chip.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20181029005846/en/
Toshiba: "TC35681IFTG," a new Bluetooth(R) 5 IC for automotive applications (Photo: Business Wire)
In addition to the basic functions of Host Controller Interface (HCI) profile and GATT profile functions, TC35681IFTG adds the new functions defined by Bluetooth® core specification 5.0, including 2Mbps throughput, Long Range and Advertising Extension functions, stored in internal mask ROM. It also integrates a high gain power amplifier and realizes +8dBm for long distance communication.
When used in conjunction with an external non-volatile memory, the new IC becomes a fully-fledged application processor that temporarily loads applications and stores in internal RAM (76KB). It can also be combined with an external host processor.
The integration of 18 General Purpose IO (GPIO) lines and multiple communications options including SPI, I2C and a 921.6kbps, two-channel UART, gives TC35681IFTG the ability to form part of sophisticated systems. The GPIO lines offer access to a range of on-chip features including a wake-up interface, four-channel PWM interface and 5-channel AD converter. An on-chip DC-DC converter or LDO circuits adjust the external voltage supply to the required values on chip.
As it is designed to be compliant with AEC-Q100, the low energy IC is primarily intended to be used in automotive applications. The wettable flank package simplifies automatic visual inspection needed to deliver the high levels of soldering quality required to withstand the vibration experienced in automotive applications.
Current applications include Remote Keyless Entry, On-Board Diagnostics to collect sensor data, Tire Pressure Monitoring Systems, and other contributors to improved vehicle comfort and safety.
|– Low power consumption:|
|6.0mA (transmitter operation @3.0V, output power: 0dBm, 1Mbps mode)|
|6.5mA (transmitter operation @3.0V, output power: 0dBm, 2Mbps mode)|
|11.0mA (transmitter operation @3.0V, output power: 8dbm, 1Mbps mode)|
|11.5mA (transmitter operation @3.0V, output power: 8dBm, 2Mbps mode)|
|5.1mA (receiver operation @3.0V, 1Mbps mode)|
|5.5mA (receiver operation @3.0V, 2Mbps mode)|
|50nA in deep sleep (@3.0V)|
|– High receiver sensitivity:|
|-95.6dBm (1Mbps mode)|
|-93.2dBm (2Mbps mode)|
|-101.2dBm (500kbps mode (S=2))|
|-105.2dBm (125kbps mode (S=8))|
|– Supports Bluetooth® LE v5.0 central and peripheral devices|
|– Built-in GATT (Generic Attribute Profile)|
|– Supports servers and client functions defined by GATT|
|– Additional features as defined by Bluetooth® LE v5.0|
|Long Range (Coded PHY)|
|– Supports automotive reliability|
|Compliant with AEC-Q100|
Operation in wide temperature range
|Wettable flank package|
Bluetooth® low energy communication devices for automotive and industrial applications.
|1.8V to 3.6V|
Current consumption in
|11.0mA (@3.0V, Output Power: 8dBm, 1Mbps mode )|
Current consumption in
|5.1mA (@3.0V, 1Mbps mode)|
Current consumption in
|-40°C to 125°C|
|Package||QFN40 6mm x 6mm 0.5mm pitch, wettable flank|
|Bluetooth® Low Energy v5.0|
|8dBm to -20dBm (8,7,6,4,0,-6,-20dB)|
|Receiver sensitivity||-95.6dBm (1Mbps mode)|
|Profiles||HCI, GATT (Generic Attribute Profile), including server and client functions|
|Interfaces||UART, I2C, SPI, GPIO, SWD|
|Other features||Compliant with AEC-Q100
Central and peripheral functions
Low drop regulator
General purpose ADC
User program function
Wake up signal for host device
 Low power consumption communication technology defined in Bluetooth® v4.0.
 Refer to Bluetooth® core specification v5.0 for full details of added features.
 Qualification expected by spring of 2019.
* Bluetooth® is a registered trademark of Bluetooth SIG, Inc.
* Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
For more information about the new product, please visit:
For more information about the line-up of Bluetooth® wireless communication ICs, please visit:
System LSI Marketing Dept.II
Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.
About Toshiba Electronic Devices & Storage Corporation
Toshiba Electronic Devices & Storage Corporation combines the vigor of a new company with the wisdom of experience. Since becoming an independent company in July 2017, we have taken our place among the leading general devices companies, and offer our customers and business partners outstanding solutions in discrete semiconductors, system LSIs and HDD.
Our 22,000 employees around the world share a determination to maximize the value of our products, and emphasize close collaboration with customers to promote co-creation of value and new markets. We look forward to building on annual sales now surpassing 800-billion yen (US$7 billion) and to contributing to a better future for people everywhere.
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